Substrate processing apparatus, method of adjusting parameters of coating module, and storage medium

ABSTRACT

An apparatus includes: a coating module for applying a coating liquid to each wafer and discharging a removing liquid from a nozzle toward a beveled portion of the wafer under rotation; an imaging module; and a controller for controlling: the imaging module to image outer end and rear surfaces of the wafer; obtaining a height dimension of an outer edge of a coating film with respect to an inner edge of the beveled portion based on the imaging result; determining whether or not the obtained dimension is an allowable value; if the result is negative, resetting the number of revolutions of the wafer based on the obtained dimension and a first reference data; controlling the coating module to again perform the application and removal operations; performing the determination process; and if the result is positive, storing the reset number of revolutions in a storage part.

CROSS-REFERENCE TO RELATED APPLICATION

This is a Continuation Application of U.S. patent application Ser. No.16/193,349, filed Nov. 16, 2018, an application claiming the benefitfrom Japanese Patent Application No. 2017-222929, filed on Nov. 20,2017, the contents of each of which are hereby incorporated by referencein their entirety.

TECHNICAL FIELD

The present disclosure relates to a technique of adjusting parametersused in a coating module which forms a coating film on a semiconductorwafer and subsequently, removes the coating film formed on a beveledportion or peripheral portion of the semiconductor wafer with a removingliquid.

BACKGROUND

As one of the processes performed in photolithography of forming acoating film pattern on a semiconductor wafer (hereinafter, referred toas a wafer) as a substrate, there is a process of forming a coating filmon a front surface of the wafer. In a coating module that performs sucha process, for example, a coating liquid is supplied onto a centralportion of the wafer which is rotating while being mounted on a spinchuck so that a coating film is formed on the wafer. When the coatingfilm is formed on the surface of the wafer in this manner, there may bea case where an end portion of the coating film is removed to remove anunnecessary film in a peripheral portion of the coating in a ring shapeor a rear surface of the wafer is cleaned by the coating module. Theremoval of the end portion of the coating film is performed by locallydischarging a solvent of the coating film from a nozzle to theperipheral portion of the wafer which is rotating by the spin chuck. Thecleaning of the rear surface is performed by discharging a cleaningliquid from a cleaning nozzle toward the rear surface of the wafer whichis rotating by the spin chuck.

In such a coating module, when a new coating liquid or cleaning liquidis used, an adjustment operation is carried out in advance on parametersthat may affect the removal of the end portion of the coating film orthe cleaning of the rear surface prior to actually processing asemiconductor wafer as a product. Conventionally, after a predeterminedprocess is performed on a wafer for parameter adjustment in the coatingmodule, the respective wafer is transferred to an inspection apparatussuch as, e.g., a microscope or the like. In this inspection apparatus,the front surface or the rear surface of the wafer is observed torecognize a cutting state or a cleaning state of the end portion of thecoating film, and change values of the parameters based on therecognized state. Then, a predetermined process is again performed inthe coating module using the changed parameters, and thereafter, aninspection is conducted in the inspection apparatus to adjust theparameters. That is to say, the adjustment was made in a trial and errormanner. Therefore, it takes a lot of time and labor and an experiencedoperator is needed to adjust the parameters, which is a complicatedwork.

For example, a technique has been used to set parameters within anappropriate range by approximating a film thickness distribution to alinear function and a quadratic function which indicate a relationshipbetween a position and a film thickness of the substrate, and changingthe parameters for adjusting the film thickness of the coating filmbased on these functions. However, this technique does not take intoconsideration parameters which may affect the cutting state of the endportion of the coating film or the cleaning state of the rear surface ofthe wafer.

Further, there is another technique which images an end portion surfaceof the substrate to obtain a shape data of the end portion surface,recognizes an amount of warping of the substrate, and determines asupply position of a solvent based on the warp amount, when removing anunnecessary film by supplying the solvent to a peripheral portion of acoating film after forming the coating film. However, this techniquedoes not adjust parameters by recognizing the cutting state of the endportion of the coating film or the cleaning state of the rear surface ofthe substrate.

SUMMARY

Some embodiments of the present disclosure provide a technique capableof easily adjusting parameters by automatically adjusting parameters ofa coating module when forming a coating film on a semiconductor waferand subsequently, removing the coating film formed on a beveled portionor peripheral portion of the semiconductor wafer by the coating module.

According to one embodiment of the present disclosure, there is provideda substrate processing apparatus for forming a coating film on asemiconductor wafer, including: a loading/unloading block into and fromwhich a transfer container configured to accommodate a plurality ofsemiconductor wafers is loaded and unloaded; a coating module configuredto apply a coating liquid to each of the plurality of semiconductorwafers taken out of the transfer container loaded into theloading/unloading block, and subsequently, in a state where thesemiconductor wafer is rotated, discharge a removing liquid from abeveled portion film removing nozzle toward a beveled portion of thesemiconductor wafer to remove the coating film formed on the beveledportion; an imaging module including an imaging part configured to imagethe semiconductor water; a semiconductor wafer transfer mechanismconfigured to transfer the semiconductor wafer between the coatingmodule and the imaging module; a storage part; and a controllerconfigured to: control the imaging module to image an outer end surfaceand a rear surface of the semiconductor wafer selected for a parameteradjustment among the plurality of semiconductor wafers, which isprocessed by the coating module; obtain a height dimension of an outeredge of the coating film with respect to an inner edge of the beveledportion of the semiconductor wafer based on an imaging result obtainedby the imaging module; determine whether or not the obtained heightdimension is a first allowable value; if the obtained height dimensionis determined to be not the first allowable value, reset the number ofrevolutions of the semiconductor wafer based on the obtained heightdimension and a first reference data indicating a relationship between apreviously-prepared height dimension and a previously-prepared number ofrevolutions of the semiconductor wafer; control the coating module toagain perform the application of the coating liquid onto thesemiconductor wafer for the parameter adjustment and the removal of thecoating film formed on the beveled portion; subsequently, determinewhether the obtained height dimension is the first allowable value; andif the obtained height dimension is determined to be the first allowablevalue, store the reset number of revolutions of the semiconductor waferin the storage part as a parameter for processing the semiconductorwafer as a product.

According to another embodiment of the present disclosure, there isprovided a substrate processing apparatus for forming a coating film ona semiconductor wafer, including: a loading/unloading block into andfrom which a transfer container configured to accommodate a plurality ofsemiconductor wafers is loaded and unloaded; at least one coating moduleconfigured to apply a coating liquid to each of the plurality ofsemiconductor wafers taken out of the transfer container loaded into theloading/unloading block, and subsequently, in a state where thesemiconductor wafer is rotated, discharge a removing liquid from aperipheral portion film removing nozzle toward a front surface inward ofa beveled portion of the semiconductor wafer to remove the coating filmformed on the peripheral portion; an imaging module including an imagingpart, configured to image the semiconductor wafer; a semiconductor wafertransfer mechanism configured to transfer the semiconductor waferbetween the at least one coating module and the imaging module; astorage part; and a controller configured to: control the imaging moduleto image the front surface of the semiconductor wafer selected for aparameter adjustment among the plurality of semiconductor wafers, whichis processed by the at least one coating module; obtain a degree ofdisturbance of a cut surface from an outer edge of the coating film toan inner edge of the beveled portion of the semiconductor wafer based onan imaging result obtained by the imaging module; determine whether ornot the obtained degree of disturbance of the cut surface is a firstallowable value; if the obtained degree of disturbance of the cutsurface is determined to be not the first allowable value, reset acoating film drying time based on the obtained degree of disturbance ofthe cut surface and a first reference data indicating a relationshipbetween a previously-prepared degree of disturbance of the cut surfaceand a previously-prepared coating film drying time required to dry thecoating film prior to removing the coating film formed on the peripheralportion; control the at least one coating module to again perform theapplication of the coating liquid onto the semiconductor wafer for theparameter adjustment and the removal of the coating film formed on theperipheral portion; subsequently, determine whether or not the obtaineddegree of disturbance of the cut surface is the first allowable value;and if the obtained degree of disturbance of the cut surface isdetermined to be the first allowable value, store the reset coating filmdrying time in the storage part as a parameter for processing thesemiconductor wafer as a product.

According to another embodiment of the present disclosure, there isprovided a method of adjusting a parameter during processing of acoating module in a substrate processing apparatus for forming a coatingfilm on a semiconductor wafer, wherein the apparatus includes: aloading/unloading block into and from which a transfer containerconfigured to accommodate a plurality of semiconductor wafers is loadedand unloaded; a coating module configured to apply a coating liquid toeach of the plurality of semiconductor wafers taken out of the transfercontainer loaded into the loading/unloading block, and subsequently, ina state where the semiconductor wafer is rotated, discharge a removingliquid from a beveled portion film removing nozzle toward a beveledportion of the semiconductor wafer to remove the coating film formed onthe beveled portion; an imaging module including an imaging partconfigured to image the semiconductor wafer; a semiconductor wafertransfer mechanism configured to transfer the semiconductor waferbetween the coating module and the imaging module; and a storage part,the method comprising: imaging, by the imaging module, an outer endsurface and a rear surface of the semiconductor wafer selected for aparameter adjustment among the plurality of semiconductor wafers, whichis processed by the coating module; obtaining a height dimension of anouter edge of the coating film with respect to an inner edge of thebeveled portion of the semiconductor wafer based on an imaging resultobtained by the imaging module; determining whether or not the obtainedheight dimension is a first allowable value; if the obtained heightdimension is determined to be not the first allowable value, resettingthe number of revolutions of the semiconductor wafer based on theobtained height dimension and a first reference data indicating arelationship between a previously-prepared height dimension and apreviously-prepared number of revolutions of the semiconductor wafer;controlling the coating module to again perform the application of thecoating liquid onto the semiconductor wafer for the parameter adjustmentand the removal of the coating film formed on the beveled portion;subsequently, determining whether or not the obtained height dimensionis the first allowable value; and if the obtained height dimension isdetermined to be the first allowable value, storing the reset number ofrevolutions of the semiconductor wafer in the storage part as theparameter for processing the semiconductor wafer as a product.

According to another embodiment of the present disclosure, there isprovided a method of adjusting a parameter during processing of acoating module in a substrate processing apparatus for forming a coatingfilm on a semiconductor wafer, wherein the apparatus includes: aloading/unloading block into and from which a transfer containerconfigured to accommodate a plurality of semiconductor wafers is loadedand unloaded; at least one coating module configured to apply a coatingliquid to each of the plurality of semiconductor wafers taken out of thetransfer container loaded into the loading/unloading block, andsubsequently, in a state where the semiconductor wafer is rotated,discharge a removing liquid from a peripheral portion film removingnozzle toward a front surface inward of a beveled portion of thesemiconductor wafer to remove the coating film formed on the peripheralportion; an imaging module including an imaging part configured to imagethe semiconductor wafer; a semiconductor wafer transfer mechanismconfigured to transfer the semiconductor wafer between the at least onecoating module and the imaging module; and a storage part, the methodcomprising: controlling the imaging module to image the front surface ofthe semiconductor wafer selected for a parameter adjustment among theplurality of semiconductor wafers, which is processed by the at leastone coating module; obtaining a degree of disturbance of a cut surfacefrom an outer edge of the coating film to an inner edge of the beveledportion of the semiconductor wafer based on an imaging result obtainedby the imaging module; determining whether or not the obtained degree ofdisturbance of the cut surface is a first allowable value; if theobtained degree of disturbance of the cut surface is determined to benot the first allowable value, resetting a coating film drying timebased on the obtained degree of disturbance of the cut surface and afirst reference data indicating a relationship between apreviously-prepared degree of disturbance of the cut surface and apreviously-prepared coating film drying time required to dry the coatingfilm prior to the removal of the coating film formed on the peripheralportion; controlling the at least one coating module to again performthe application of the coating liquid onto the semiconductor wafer forthe parameter adjustment and the removal of the coating film formed onthe peripheral portion; subsequently, determining whether or not theobtained degree of disturbance of the cut surface is the first allowablevalue; and if the obtained degree of disturbance of the cut surface isdetermined to be the first allowable value, storing the reset coatingfilm drying time in the storage part as the parameter for processing thesemiconductor wafer as a product.

According to another embodiment of the present disclosure, there isprovided a non-transitory computer-readable recording medium storing acomputer program for use in a substrate processing apparatus for forminga coating film on a semiconductor wafer, the apparatus comprising: aloading/unloading block into and from which a transfer containerconfigured to accommodate a plurality of semiconductor wafers is loadedand unloaded; a coating module configured to apply a coating liquid toeach of the plurality of semiconductor wafers taken out of the transfercontainer loaded into the loading/unloading block; an imaging moduleincluding an imaging part configured to image the semiconductor wafer;and a semiconductor wafer transfer mechanism configured to transfer thesemiconductor wafer between the coating module and the imaging module,wherein the computer program includes a group of steps for executing theaforementioned method.

BRIEF DESCRIPTION OF DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of the specification, illustrate embodiments of the presentdisclosure, and together with the general description given above andthe detailed description of the embodiments given below, serve toexplain the principles of the present disclosure.

FIG. 1 is a configuration diagram illustrating a major part of oneembodiment of a substrate processing apparatus according to the presentdisclosure.

FIG. 2 is a longitudinal cross-sectional view illustrating a coatingmodule.

FIG. 3 is a partial longitudinal cross-sectional view illustrating abeveled portion cleaning nozzle.

FIG. 4 is a process view illustrating an operation of a coating moduleaccording to a first embodiment of the present disclosure.

FIG. 5 is a process view illustrating an operation of the coating moduleaccording to the first embodiment.

FIG. 6 is a process view illustrating an operation of the coating moduleaccording to the first embodiment.

FIG. 7 is a process view illustrating an operation of the coating moduleaccording to the first embodiment.

FIG. 8 is a schematic perspective view illustrating an imaging module.

FIG. 9 is a configuration diagram schematically illustrating anoperation of the imaging module.

FIG. 10 is a configuration diagram schematically illustrating anoperation of the imaging module.

FIG. 11 is a configuration diagram illustrating a control part of asubstrate processing apparatus.

FIG. 12 is a partial longitudinal cross-sectional view illustrating abeveled portion of a wafer.

FIG. 13 is a plan view schematically illustrating an imaging result.

FIG. 14 is a flowchart illustrating an operation of the coating moduleaccording to the first embodiment.

FIG. 15 is a characteristic diagram illustrating a reference data whichindicates a relationship between a cutting height and a number ofrevolutions, and an actual data.

FIG. 16 is a characteristic diagram illustrating a reference data whichindicates a relationship between a degree of contamination and acleaning time, and an actual data.

FIGS. 17A to 17C are partial longitudinal cross-sectional viewsillustrating a beveled portion of a wafer to illustrate a cuttingheight.

FIG. 18 is a process view illustrating an operation of a coating moduleaccording to a second embodiment of the present disclosure.

FIG. 19 is a process view illustrating an operation of the coatingmodule according to the second embodiment.

FIG. 20 is a process view illustrating an operation of the coatingmodule according to the second embodiment.

FIG. 21 is a process view illustrating an operation of the coatingmodule according to the second embodiment.

FIG. 22 is a flowchart illustrating an operation of the coating moduleaccording to the second embodiment.

FIG. 23 is a characteristic diagram illustrating a reference data whichindicates a relationship between a degree of disturbance and a dryingtime of a cut surface, and an actual data.

FIG. 24 is a plan view illustrating a coating/developing apparatusconstituting the substrate processing apparatus.

FIG. 25 is a longitudinal cross-sectional view illustrating thecoating/developing apparatus.

DETAILED DESCRIPTION

Reference will now be made in detail to various embodiments, examples ofwhich are illustrated in the accompanying drawings. In the followingdetailed description, numerous specific details are set forth in orderto provide a thorough understanding of the present disclosure. However,it will be apparent to one of ordinary skill in the art that the presentdisclosure may be practiced without these specific details. In otherinstances, well-known methods, procedures, systems, and components havenot been described in detail so as not to unnecessarily obscure aspectsof the various embodiments.

First Embodiment

FIG. 1 illustrates a schematic configuration of a coating/developingapparatus 1 constituting a substrate processing apparatus according tothe present disclosure. The coating/developing apparatus 1 includes aloading/unloading block S1 into and from which a transfer container Cconfigured to accommodate and transfer a plurality of wafers W is loadedand unloaded, and a processing block S2. A coating module 2 for applyinga coating liquid to the wafers W and an imaging module 3 for imaging thewafers W are installed inside the processing block S2. The wafers aretransferred between the transfer container C and the coating module 2and the imaging module 3 by a transfer mechanism 11 constituting asemiconductor wafer transfer mechanism.

A wafer W for parameter adjustment s picked up from the transfercontainer C and is transferred to the coating module 2. In the coatingmodule 2, the application of the coating liquid, removal of a coatingfilm formed on a beveled portion and cleaning of a rear surface of thewafer W are performed. Subsequently, the wafer W is transferred to theimaging module 3 where an outer end surface and the rear surface of thewafer W are imaged. Then, based on the imaging results, the number ofrevolutions (the number of rinsing revolutions) during the removal ofthe coating film in the beveled portion and a cleaning time taken forthe cleaning of the rear surface, which are parameters of the coatingmodule 2, are automatically adjusted by a control part 100. Hereinafter,a process of removing the coating film in the beveled portion will bedescribed as a beveled portion cleaning process.

Next, one embodiment of the coating module 2 will be described withreference to FIGS. 2 and 3. In FIGS. 2 and 3, reference numeral 21 is aspin chuck serving as a substrate holding part that holds and rotatesthe wafer W. The spin chuck 21 is configured to hold the wafer W in ahorizontal posture by adsorbing a central portion of the rear surface ofthe wafer W. Further, the spin chuck 21 is configured to be rotatablearound a vertical axis, for example, in a clockwise direction whenviewed from the top and movable up and down, by a driving mechanism 211through a shaft 212.

A cup 22 is installed around the wafer W held by the spin chuck 21. Alower portion of the cup 22 is exhausted through an exhaust pipe 221 andis connected to a liquid drain pipe 222. In addition, a circular plate213 is installed below the spin chuck 21 so as to surround the shaft212. A ring-shaped mountain-like member 214 having a mountain-likesection shape is formed around the circular plate 213. A projection 215for suppressing inflow of mist flowing inside the cup 22 to the side ofthe rear surface of the wafer is formed at the top of the mountain-likemember 214.

The coating module 2 includes a coating liquid nozzle 24 for dischargingthe coating liquid and a solvent nozzle 25 for discharging a solvent ofthe coating liquid. The coating liquid nozzle 24 is coupled to a coatingliquid supply mechanism 242 via a flow path 241 in which anopening/closing valve V1 is installed. The solvent nozzle 25 is a nozzleused for pre-process performed prior to discharging the coating liquidto the wafer W. The solvent nozzle 25 is coupled to a solvent supplymechanism 252 via a flow path 251 in which an opening/closing valve V2.The coating liquid nozzle 24 and the solvent nozzle 25 are configured tobe movable between above the central portion of the wafer W and aretreat position defined outside the cup 22 by a movement mechanism (notshown).

In addition, the coating module 2 includes a removing liquid nozzle 26that is a nozzle for removing a film formed on a peripheral portion ofthe wafer W, a beveled portion cleaning nozzle 27 for removing a filmformed on the beveled portion, and a rear surface cleaning nozzle 25.The removing liquid nozzle 26 discharges a removing liquid to thesurface of the wafer W inward of the beveled portion of the wafer W heldby the spin chuck 21 so that the removing liquid is directed to thedownstream side of the wafer W in the rotation direction. The removingliquid nozzle 26 is formed in, for example, a straight tube shape. Aleading end of the removing liquid nozzle 26 is opened as a dischargeport of the removing liquid. The removing liquid nozzle 26 is configuredto be movable, for example, between a processing position where theremoving liquid is discharged to the peripheral portion of the wafer anda retreat position defined outside the cup 22 by a movement mechanism(not shown).

Furthermore, the beveled portion cleaning nozzle 27 is provided todischarge a removing liquid toward the beveled portion at the side ofthe rear side of the wafer W supported by the spin chuck 21. The beveledportion cleaning nozzle 27 is configured to be movable along a base 271.The base 271 is installed in, for example, a notch portion (not shown)formed in the mountain-like member 214. In addition, as illustrated inFIG. 3, the beveled portion cleaning nozzle 27 includes an inclinedsurface portion 272. A tip formed by extending the inclined surfaceportion 272 constitutes a projection 273. As described above, thebeveled portion cleaning nozzle 27 is configured to serve as a portionof the mountain-like member 214, and the projection 273 is configured toserve as a portion of the projection 215 of the mountain-like member214.

A removing liquid supply passage 270 is formed inside the beveledportion cleaning nozzle 27. The removing liquid is supplied obliquelyupward from a discharge port 274 formed in a leading end of the removingliquid supply passage 270. For example, when the removing liquid isdischarged toward the wafer W, it is set such that the removing liquidreaches a beveled portion W0, specifically such that a reaching point ofthe removing liquid on the wafer W falls within a range of, e.g., 0 to4.5 mm, inward from the outer edge of the wafer W.

The rear surface cleaning nozzle 28 is provided to discharge a cleaningliquid to the rear surface of the wafer W inward of the beveled portionW0 of the wafer W held by the spin chuck 21. For example, when thecleaning liquid is discharged toward the wafer W, it is set such that areaching point of the cleaning liquid on the wafer W falls within, e.g.,70 mm, inward from the outer edge of the wafer W. For example, twobeveled portion cleaning nozzles 27 and two rear surface cleaningnozzles 28 are respectively installed at, for example, positionsdiametrically facing each other, on the circular plate 213 in thecoating module 2 (see FIGS. 5 and 6).

In this embodiment, both the removing liquid and the cleaning liquid aresolvents of the coating film. The removing liquid nozzle 26 is coupledto, for example, the solvent supply mechanism 252, via a flow path 261in which an opening/closing valve V3 is installed. The beveled portioncleaning nozzle 27 is coupled to, for example, the solvent supplymechanism 252 via a flow path 275 in which an opening/closing valve V4is installed. Furthermore, the rear surface cleaning nozzle 28 iscoupled to, for example, the solvent supply mechanism 252 via a flowpath 281 in which an opening/closing valve V5 is installed.

An example of the process performed by the coating module 2 will bedescribed with reference to FIGS. 4 to 7. First, the wafer W istransferred to and mounted on the spin chuck 21 by the transfermechanism 11. The solvent is discharged from the solvent nozzle 25 ontothe central portion of the wafer W. The solvent is applied on the entirefront surface of the wafer W by virtue of a centrifugal force generatedby rotating the wafer W. Subsequently, in the state where the wafer W isrotated, the coating liquid, for example, a resist liquid, is dischargedfrom the coating liquid nozzle 24 onto the central portion of therotating wafer W. The coating liquid is applied on the entire frontsurface of the wafer W by virtue of the centrifugal force. Thereafter, aliquid film is dried by rotating the wafer W for a predetermined periodof time. In this way, a coating film 10 is formed (FIG. 4).

Subsequently, the cleaning of the bevel portion and the rear surface areperformed. In this embodiment, as illustrated in FIGS. 5 and 6, forexample, the removing liquid and the cleaning liquid are simultaneouslydischarged from the beveled portion cleaning nozzles 27 and the rearsurface cleaning nozzles 28 toward the wafer W while rotating the waferW. Accordingly, the removing liquid (solvent) discharged from thebeveled portion cleaning nozzle 27 is biased outward of the wafer W byvirtue of the centrifugal force of the wafer W and goes around thebeveled portion W0 to the side of the front surface of the wafer. In aregion to which the removing liquid is supplied, the coating film issoftened and dissolved by the removing liquid, and is pushed out outwardof the wafer W by virtue of the centrifugal force. Thus, the coatingfilm is removed. At this time, the removing liquid hardly goes aroundthe front surface of the wafer as the number of revolutions (number ofrinsing revolutions) of the wafer W increases. When the removing liquidgoes too around the front surface, the coating film formed onward of adesired region may be removed. Meanwhile, when the amount of theremoving liquid which goes around the front surface is too small, thecoating film may remain on the beveled portion W0.

In the present embodiment, as will be described later, the number ofrinsing revolutions is adjusted by obtaining a cutting height. A cuttingheight H denotes a height dimension of an outer edge of the coating filmwith respect to an inner edge of the beveled portion W0 of the wafer W,as illustrated in FIG. 12 which will be described later. As illustratedin FIG. 12, a distance between an outer edge of the wafer (an outer edgeof the beveled portion W0) and the outer edge of the coating film in thelateral direction is assumed to be a cutting width W. It is difficultfor the removing liquid to go around the front surface of the wafer asthe number of rinsing revolutions increases. Thus, the cutting width Wof the coating film in the end portion of the wafer decreases and thecutting height H increases. As described above, the cutting height andthe cutting width have a correlation with each other.

Turning back to FIG. 6 and continuing the description, the contaminationcaused by the coating liquid adhering to the rear surface of the wafer Wis removed by the cleaning liquid (solvent) discharged from the rearsurface cleaning nozzles 28. The coating film dissolved thus isprevented from going around the rear surface and adhering to the rearsurface. In such a rear surface cleaning, the longer the cleaning time,the less a film residue which represents a degree of contaminationcaused by the coating liquid in the rear surface of the wafer(hereinafter, referred to as “degree of contamination”). After thecleaning the beveled portion and the rear surface are performed in thismanner, as illustrated in FIG. 7, the discharge of the removing liquidfrom the beveled portion cleaning nozzles 27 and the discharge of thecleaning liquid from the rear surface cleaning nozzles 28 arerespectively stopped. Subsequently, the removing liquid and the cleaningliquid existing on the wafer W are shake-off dried by rotating the waferW, and the process performed in the coating module 2 is completed.

Next, the imaging module 3 will be described with reference to FIGS. 8to 10. FIG. 8 is a schematic perspective view illustrating major partsof the imaging module 3, and FIGS. 9 and 10 schematically illustrate themajor parts to illustrate an operation of the imaging module 3. Theimaging module 3 is provided to image an outer end surface and the rearsurface of the wafer W. The imaging module 3 includes a holding table 31which holds the wafer W in a horizontal posture and is configured torotate around a vertical axis by a rotary mechanism 311. The rotarymechanism 311 includes, for example, an encoder for detecting arotational position of the holding table 31. The rotary mechanism 311 isconfigured to associate an imaging position and a rotational position ofeach surface of the wafer W obtained by a peripheral edge imaging part 4and a rear surface imaging part 5 (both to be described later) with oneanother.

The peripheral edge imaging part 4 is provided to simultaneously image,for example, a peripheral region Wa of the front surface of the wafer Wand an outer end surface Wb (the beveled portion W0) of the wafer W. Asillustrated in FIGS. 8 and 9, the peripheral edge imaging part 4includes a camera 41 as an imaging means, an illumination part 42, and amirror member 43. The camera 41 and the illumination part 42 areinstalled to face each other. The camera 41 includes a lens 411 and animaging element 412 configured as, for example, a CCD image sensor.

The illumination part 42 includes a light source 421, a half mirror 422,and a focus adjustment lens 423, which are disposed above the wafer Wheld by the holding table 31. The half mirror 422 is formed in, forexample, a rectangular shape, and is arranged to be inclined byapproximately 45 degrees with respect to the horizontal direction. Thefocus adjustment lens 423 has a function of changing a synthetic focallength with the lens 411.

The peripheral edge imaging part 4 includes a mirror member 43. Themirror member 43 is disposed below the half mirror 422 and is installedto face the outer end surface Wb of the wafer W held by the holdingtable 31 and a peripheral region of the rear surface of the wafer W. Aportion of the mirror member 43 which faces the outer end surface Wb andthe like of the wafer We is formed as a curved concave surface which isdepressed to be spaced apart by a predetermined distance from the outerend surface Wb of the wafer W held by the holding table 31. The curvedconcave surface is, for example, a reflective surface 431 which issubjected to a mirroring treatment.

In the illumination part 42, light emitted from the light source 421passes through the half mirror 422 and is irradiated downward. Adiffused light that has passed through the half mirror 422 is reflectedat the reflective surface 431 of the mirror member 43. A reflectedlight, which is obtained by reflecting the diffused light at thereflective surface 431, is mainly irradiated to the outer end surface Wbof the wafer W and the peripheral region Wa of the front surface of thewafer W. A reflected light reflected off the peripheral region Wa of thefront surface of the wafer W is again reflected at the half mirror 422,as indicated by an alternate long and short dash line in FIG. 9. Thisreflected light passes through the lens 411 of the camera 41 withoutpassing through the focus adjustment lens 423 and is incident on theimaging element 412. Meanwhile, a reflected light reflected off theouter end surface Wb of the wafer W is reflected at the reflectivesurface 431 of the mirror member 43 and the half mirror 422 in thisorder, as indicated by a dotted line in FIG. 9, and sequentially passesthrough the focus adjustment lens 423 and the lens 411 and is incidenton the imaging element 412.

As described above, since both the light originated from the peripheralregion Wa of the front surface of the wafer W and the light originatedfrom the outer end surface Wb of the wafer W are inputted to the imagingelement 412 of the camera 41, the camera 41 can capture both theperipheral region Wa of the front surface of the wafer W and the outerend surface Wb of the wafer W. Data of images captured by the camera 41is transmitted to, for example, the control part 100.

As illustrated in FIGS. 8 and 10, the rear surface imaging part 5includes a camera 51 and an illumination part 52. The camera 51 servesas an imaging means which includes a lens 511 and an imaging element 512configured as, for example, a CCD image sensor. The camera 51 and theillumination part 52 are installed so as to face each other. Theillumination part 52 is disposed below the water W held by the holdingtable 31, and includes a light source 521 and a half mirror 522. Thehalf mirror 522 is formed in, for example, a rectangular shape, and isarranged to be inclined by approximately 45 degrees with respect to thehorizontal direction. Light emitted from the light source 521 positionedbelow the half mirror 522 entirely passes through the half mirror 522and is oriented upward. Light that has passed through the half mirror522 is reflected at the rear surface of the wafer W, is then reflectedagain at the half mirror 522, passes through the lens 511 of the camera51, and is incident on the imaging element 512. In this manner, data ofa captured image of the rear surface of the wafer W, which is capturedby the imaging element 512, is transmitted to, for example, the controlpart 100.

In the imaging module 3, based on a control signal provided from thecontrol part 100, the holding table 31 on which the wafer W is mountedis rotated by the rotary mechanism 311. In this state, in the peripheraledge imaging part 4 and the rear surface imaging part 5, the lightsources 421 and 521 are respectively turned on so that the imagingoperations of the cameras 41 and 51 are performed. In this manner, theperipheral region Wa of the front surface of the wafer W, the outer endsurface Wb of the wafer W, and the rear surface We of the wafer W areimaged over the entire peripheral edge of the wafer W. When the wafer Wis rotated once and the imaging by the cameras 41 and 51 is completed,the data of images captured by the cameras 41 and 51 is transmitted tothe control part 100 as described hereinbelow.

The coating/developing apparatus 1 includes the control part 100. Asillustrated in FIG. 11, for example, the control part 100 includes a CPU101, a storage part 102, a program storage part 103 configured as acomputer, an image analysis part 104, an input part 105, and a displaypart 106. A program having instructions (a group of steps) forperforming a coating film forming process and a parameter adjustment asdescribed hereinbelow is stored in the program storage part 103. By thisprogram, control signals are outputted from the control part 100 torespective parts of the coating/developing apparatus 1, whereby theoperations of the respective parts of the coating/developing apparatus 1are controlled. This program is stored in the program storage part in astate of being stored in a storage medium such as, e.g., a hard disk, acompact disc, a magneto-optical disc, a memory card or the like.

Various recipes related to a process performed by the coating/developingapparatus 1 are stored in the storage part 102. For the parameteradjustment, for example, imaging results captured by the imaging module3, a recipe performed in the coating module 2, a reference data and anactual data (to be described later) and the like are stored in thestorage part 102. The image analysis part 104 has a function ofobtaining a cutting height and a degree of contamination of the rearsurface of the wafer based on the imaging results (image data) capturedby the imaging module 3. A method of obtaining a cutting height from theimaging results will be described later. For example, in a case ofadjusting the parameters, the input part 105 has a function of inputtinga target value or the like of the cutting height. In a case where aplurality of coating modules 2 is provided, the input part 105 has afunction of selecting, among the plurality of coating modules 2, acoating module 2 for adjustment, and a recipe to be performed by therespective coating module 2, or the like. In the case of adjusting theparameters, the display part 106 has a function of, for example,displaying results of parameter adjustment or the like.

Various programs stored in the program storage part 103 also include aparameter adjustment program. The parameter adjustment program has afunction of determining whether or not the cutting height obtained basedon the imaging result of the wafer W is an allowable value, and if it isnot an allowable value, resetting the number of revolutions of thebeveled portion cleaning process (the number of rinsing revolutions)based on the obtained cutting height and a reference data of therespective cutting height. The reference data of the cutting height isdata indicating a relationship between the cutting height and the numberof rinsing revolutions which are prepared in advance. For example, thereference data of the cutting height is data previously acquired byusing a resist different from one being currently processed or acleaning liquid different from one being currently used.

In addition, the parameter adjustment program has a function of againperforming the application of the coating liquid and the cleaning of thebeveled portion with respect to the wafer for adjustment by using thecoating module 2 based on the reset number of rinsing revolutions.Thereafter, the parameter adjustment program has a function ofdetermining whether or not the cutting height obtained from the imagingresult is an allowable value in the same manner, and if it is anallowable value, storing the reset number of rinsing revolutions in thestorage part 102 as a parameter (hereinafter, referred to as a“parameter for processing”) used when processing a semiconductor waferas a product (hereinafter, referred to as a “product wafer”).

Furthermore, in addition to the function of determining the cuttingheight, the parameter adjustment program of this example has a functionof determining whether or not the degree of contamination obtained basedon the imaging result of the wafer W is an allowable value, and if it isnot an allowable value, resetting the cleaning time based on theobtained degree of contamination and a reference data of the degree ofcontamination. The reference data of the degree of contamination is dataindicating a relationship between the degree of contamination and thecleaning time of the rear surface of the wafer (hereinafter, simplyreferred to as “cleaning time”) which are prepared in advance. Forexample, the in addition to the function of determining the cuttingheight is data previously acquired by using a resist different from onebeing currently processed or a cleaning liquid different from one beingcurrently used.

In addition, the parameter adjustment program has a function ofperforming the application of the coating liquid, the cleaning of thebeveled portion and the cleaning of the rear surface with respect to thewafer W for adjustment by using the coating module 2 during the resetcleaning time. Thereafter, the parameter adjustment program has afunction of determining whether or not the degree of contaminationobtained from the imaging result is an allowable value in the samemanner, and if it is an allowable value, storing the reset cleaning timein the storage part 102 as a parameter for process.

Furthermore, when a first series of operations and a second series ofoperations are performed and subsequently, a third series of operationsare further performed, the parameter adjustment program is configured toreset the number of rinsing revolutions with an actual data instead ofthe reference data. Here, the series of operations are operations ofobtaining the cutting height and determining whether or not the obtainedcutting height is an allowable value after performing the application ofthe coating liquid and the cleaning of the beveled portion with respectto the wafer W for adjustment by the coating module 2. In addition, theactual data is data indicating a relationship between a cutting heightand the number of rinsing revolutions obtained from a first cuttingheight and the first number of rinsing revolutions acquired in the firstseries of operations and a second cutting height and the second numberof rinsing revolutions acquired in the second series of operations.

Furthermore, when the first series of operations and the second seriesof operations are performed and subsequently, the third series ofoperations is performed, the parameter adjustment program is configuredto reset the cleaning time with an actual data instead of the referencedata. The actual data is data indicating a relationship between a degreeof contamination and a cleaning time obtained from a first degree ofcontamination and a first cleaning time acquired in the first series ofoperations and a second degree of contamination and a second cleaningtime acquired in the second series of operations. Also, the series ofoperations are operations of performing the application of the coatingliquid and the cleaning of the rear surface with respect to the wafer Wfor adjustment, obtaining the degree of contamination and determiningwhether or not the degree of contamination is an allowable value by thecoating module 2.

Furthermore, when an n-th (where n is a preset natural number of 3 ormore) series of operations are completed and values (the cutting heightand the degree of contamination) obtained based on the imaging resultexceed an allowable value, the parameter adjustment program isconfigured to stop a subsequent operation.

An example of a method of obtaining a cutting height from the imagingresult by the image analysis part 104 will be described with referenceto FIGS. 12 and 13 by way of example. FIG. 12 is a longitudinalcross-sectional view of the beveled portion W0 of the wafer W and FIG.13 schematically illustrates an image data of the peripheral region Waof the front surface of the wafer W, which is captured by the peripheraledge imaging part 4 of the imaging module 3. In FIG. 12, referencesymbol H1 is a height position of the inner edge of the beveled portionW0, reference symbol H2 is a height position of the outer edge of thebeveled portion W0. In FIG. 13, reference symbol N is a notch portion.Further, reference symbol H3 is a height position of the outer edge ofthe coating film 10 (a height position of the boundary between a regionwhere the coating film 10 is formed and the beveled portion W0).

In FIG. 13, for example, reference symbol S1 indicates a region wherethe coating film is formed, reference symbol S2 indicates a region wherethe coating film is not formed (the front surface of the wafer), andreference symbol S3 indicates a region where there is no inspectionobject such as the notch portion of the water. These regions S1 to S3are indicated to have different contrasts. In FIGS. 12 and 13, referencesymbol W1 is a boundary position between the beveled portion and thefront surface of the wafer W, reference symbol W2 is a cut position, andreference symbol W3 is a wafer outer end position. Due to thedifferences in contrast, the positions W1 and W2 are detected from theimage data. As described above, the cutting height H is a heightdimension of the outer edge of the coating film with respect to theinner edge of the beveled portion W0 and has a correlation with anabsolute value of (W1−W2). Thus, the cutting position is calculated from(W1−W2). The image analysis part 104 acquires data on cutting heights at360 positions of the water W in the circumferential direction from, forexample, the image data, and obtains their average value as the cuttingheight H.

Furthermore, the image analysis part 104 recognizes a region to where afilm residue adheres on the image data of the outer end surface and therear surface of the wafer, which is captured by the peripheral edgeimaging part 4 and the rear surface imaging part 5 of the imaging module3, for example, using the differences in contrast. From this, a degreeof contamination of the rear surface of the wafer W, which is caused bythe coating liquid, is obtained. The example illustrated in FIG. 13 isalso given r understanding of the present disclosure. A state in whichthe coating film is gone around the side of the rear surface of thewafer W is recognized from the image data of the rear surface.Therefore, in an actual case, the cutting height H and the degree ofcontamination are obtained based on the imaging results of the outer endsurface and the rear surface of the wafer, which are captured by theperipheral edge imaging part 4 and the rear surface imaging part 5 ofthe imaging module 3. Thus, the degree of contamination on the rearsurface of the wafer also includes the degree of contamination (thenumber of defects) on the rear surface of the wafer and the beveledportion.

Next, an automatic adjustment of parameters in the coating module 2,which is performed by the coating/developing apparatus 1 will bedescribed. This automatic adjustment of the parameters is performed in acase where the coating/developing apparatus 1 is started up or issubjected to maintenance, where the type of coating liquid or solvent ischanged in the coating module 2, where a new coating liquid, solvent orcleaning liquid is used, or the like. Here, the case where a new coatingliquid is used will be described with reference to FIGS. 14 to 17C as anexample.

First, by the input part 105, a coating module 2 for adjustment and atarget value of the cutting height are inputted and a reference recipestored in the storage part 102 is selected. As the reference recipe, forexample, a standard recipe used for the automatic parameter adjustmentmay be prepared, or a recipe using a similar coating liquid may be used.For example, as illustrated in FIG. 15, a reference data R1 indicating arelationship between the cutting height and the number of rinsingrevolutions in the beveled portion cleaning is stored in the referencerecipe. If the target value of the cutting height is set to, e.g., 120μm, the number of rinsing revolutions in the reference recipe is set to800 rpm. Furthermore, for example, as illustrated in FIG. 16, areference data R2 indicating a relationship between the degree ofcontamination caused by the coating liquid on the rear surface of thewafer and the cleaning time on the rear surface is stored in thereference recipe. A cleaning time T1 at which the degree ofcontamination becomes an allowable value L1 is set in the referencerecipe.

Then, one wafer W is discharged from the transfer container C thataccommodates the wafer for parameter adjustment and is transferred tothe coating module 2 to form the coating film as described above. Thecleaning of the beveled portion and the cleaning of the rear surface areperformed based on the set number of rinsing revolutions of 800 rpm andthe cleaning time T1. Subsequently, the wafer W is transferred to theimaging module 3 where image data of the outer end surface and the rearsurface of the wafer W is acquired as described above (step S1). Thewafer W after imaging is returned to, for example, the respectivetransfer container C, by the transfer mechanism 11.

Subsequently, the control part 100 obtains a cutting height and a degreeof contamination based on the image data (step S2), and determineswhether or not the obtained cutting height is an allowable value (stepS1). An allowable value falls within a range of, e.g., ±10% of a targetcutting height. Furthermore, this numerical value is illustrated forunderstanding of the present disclosure but does not represent anexample of an actual machine. In this example, as illustrated in FIG.17A, the cutting height obtained from the image data is set to 60 μm.Accordingly, the process proceeds to step S4 where the number of rinsingrevolutions is reset. This resetting is performed based on the referencedata R1. Here, based on the reference data R1, the number of rinsingrevolutions is reset to, e.g., 900 rpm, to increase the cutting height.On the other hand, if it is determined that the cutting height is anallowable value, the process proceeds to steps S5 and S13. In step S13,the number of rinsing revolutions at this time is stored in the storagepart 102 as a parameter to be used when processing the product wafer W.Thereafter, the parameter adjustment operation of the number of rinsingrevolutions is ended.

In step S5, it is determined whether or not the degree of contaminationis an allowable value. If it is an allowable value, the process proceedsto step S13 where the cleaning time at this time is stored in thestorage part 102 as a parameter for processing. Thereafter, theparameter adjustment operation of the cleaning time is terminated. Onthe other hand, if the degree of contamination exceeds an allowablevalue, the process proceeds to step S6 where the cleaning time is reset,and the process proceeds to step S7. This resetting is performed basedon the reference data R2. The cleaning time is set to be lengthened soas to match the degree of contamination with the allowable value. Here,an example in which the degree of contamination exceeds the allowablevalue and thus the cleaning time is reset will be described.

In step S7, another wafer W for parameter adjustment is againtransferred to the coating module 2. In the coating module 2, thebeveled portion cleaning and the rear surface cleaning are performedwith a recipe in which the formation of the coating film, the number ofrinsing revolutions and the cleaning time are reset. Subsequently, theimage data described above is acquired by the imaging module 3 to obtainthe cutting height and the degree of contamination. The wafer W afterimaging is returned to, for example, the respective transfer containerC, by the transfer mechanism 11.

Then, the process proceeds to step S8 where it is determined whether ornot the obtained cutting height is an allowable value. In this example,as illustrated in FIG. 17B, the obtained cutting height H is set to 90μm. Therefore, the process proceeds to step S9 where it is determinedwhether or not the number of times of the beveled portion cleaningexceeds a set number of times, namely whether or not the series ofoperations exceed n times which is the set number of times. If theseries of operations is determined to have exceed the set number oftimes, namely if it is determined that the n-th series of operations arecompleted and the cutting height exceeds an allowable value, the processproceeds to step S14. In step S14, it is determined that the parameteradjustment is impossible, and for example, such an impossible state isdisplayed on the display part 106. Thereafter, the adjustment operationis terminated. From now on, for example, an operator manually performsthe parameter adjustment.

If the number of times of the beveled portion cleaning exceeds the setnumber of times in step S9, the process proceeds to step S10 where thenumber of rinsing revolutions is reset. This resetting is performedbased on an actual data A1 illustrated in FIG. 15. In FIG. 15, referencesymbol D1 is data of the cutting height (60 μm) and the number ofrinsing revolutions (800 rpm) in the first series of operations,reference symbol D2 is data of the cutting height (90 μm) and the numberof rinsing revolutions (900 rpm) in the second series of operations. Theactual data A1 indicating a relationship between the cutting height andthe number of rinsing revolutions is obtained based on the data D1 andD2. When the third series of operations are performed, the number ofrevolutions at which the cutting height becomes 120 μm, in this example,1,000 rpm, is reset based on the actual data A1. Thereafter, the processproceeds to step S11. On the other hand, if it is determined in step S8that the cutting height obtained in the second series of operations isan allowable value, the process proceeds to steps S11 and S13. In stepS13, the number of rinsing revolutions at that time is stored as aparameter for processing, and the parameter adjustment operation of thenumber of rinsing revolutions is terminated.

In step S11, it is determined whether or not the degree of contaminationis an allowable value. If the degree of contamination is an allowablevalue, the process proceeds to step S13 where the rinsing time at thistime is stored as a parameter for processing, and the parameteradjustment operation of the cleaning time is terminated. On the otherhand, if the degree of contamination exceeds an allowable value, thecleaning time is reset in step S12. This resetting is performed based onan actual data A2 (see FIG. 16) indicating a relationship between adegree of contamination and a cleaning time obtained from the degree ofcontamination and the cleaning time acquired in the first series ofoperations and the degree of contamination and the cleaning timeacquired in the second series of operations.

Subsequently, another wafer W for parameter adjustment is againtransferred to the coating module 2 to form a coating film, and abeveled portion cleaning and a rear surface cleaning are performed witha recipe in which the number of rinsing revolutions and the cleaningtime are reset. Thereafter, a cutting height and a degree ofcontamination are obtained from an imaging result of the wafer W (stepS7). A value obtained based on the imaging result in this manner becomesdata of the cutting height and the degree of contamination acquired inthe third series of operations.

Then, the process proceeds to step S8 where it is determined whether ornot the cutting height is an allowable value. In this example, asillustrated in FIG. 17C, the obtained cutting height is assumed to be120 mm. Therefore, since the cutting height is an allowable value, theprocess proceeds to steps S11 and S13. In step S13, the reset number ofrinsing revolutions is stored as a parameter for processing, and theparameter adjustment operation of the number of rinsing revolutions isterminated. If the cutting height exceeds an allowable value, theprocess proceeds to step S9 where it is determined whether or not thenumber of times of beveled portion cleaning exceeds a set number oftimes. If the number of times of beveled portion cleaning exceeds theset number of times, the number of rinsing revolutions is reset in stepS10. This resetting is performed by obtaining an actual data indicatinga relationship between the cutting height and the number of rinsingrevolutions based on the data (the cutting height and the number ofrinsing revolutions) acquired in the first series of operations, thedata acquired in the second series of operations, and the data acquiredin the third series of operations, and using the actual data thusobtained. In this manner, the number of rinsing revolutions is changed,and the process proceeds to step S11.

In step S11, it is determined whether or not a degree of contaminationis an allowable value. If the degree of contamination is an allowablevalue, the process proceeds to step S13 where the adjustment ofparameter of the cleaning time of the rear surface, which is a parameterrelated to the degree of contamination, is terminated. On the otherhand, if the degree of contamination exceeds an allowable value, thecleaning time is reset in step S12. This resetting is performed byobtaining an actual data indicating a relationship between a degree ofcontamination and a cleaning time based on the data (the degree ofcontamination and the cleaning time) acquired in the first series ofoperations, the data acquired in the second series of operations and thedata acquired in the third series of operations, and using the actualdata thus obtained. In the above description, the actual data may beapproximate curves illustrated in FIGS. 15 and 16, or approximaterelational expressions.

In this manner, if the cutting height exceeds an allowable value whilethe number of times of beveled portion cleaning does not exceed the setnumber of times, a series of operations of resetting the number ofrinsing revolutions, followed by again forming the coating film andperforming the beveled portion cleaning is performed. Thereafter, theoperation of obtaining a cutting height and determining whether or notthe cutting height thus obtained is an allowable value is repeated. Inaddition, if a degree of contamination exceeds an allowable value whilethe number of times of beveled portion cleaning does not exceed the setnumber of times, a series of operations of resetting the cleaning time,followed by again forming the coating film and performing the cleaningprocess is performed. Thereafter, the operation of obtaining a degree ofcontamination and determining whether or not the degree of contaminationthus obtained is an allowable value is repeated.

After the parameter adjustment operation is completed in this manner,processing for a plurality of wafers W is continuously performed by, forexample, the coating module 2, based on the parameters stored in thestorage part 102 as parameters to be used at the time of the processing.Then, a series of operations of obtaining a cutting height and a degreeof contamination by imagining the processed wafer W, followed bydetermining whether or not they are respective allowable values andconfirming the validity of parameters may be performed. At this time,when a problem occurs in the cutting height and the degree ofcontamination, the parameters may also be automatically adjusted or maybe finely adjusted in a manual manner.

According to the aforementioned embodiment, in the coating module 2, aseries of operations of applying the coating liquid and performing thebeveled portion cleaning on the wafer for adjustment, is performed. Theouter end surface and the rear surface of the wafer are imaged. It isdetermined whether a cutting height obtained based on the imaging resultis not an allowable value. If it is determined that the cutting heightis not an allowable value, the number of rinsing revolutions is resetbased on the reference data. Then, in the coating module 2 again, acoating liquid is applied on the wafer W for adjustment and the beveledportion cleaning is performed. It is determined whether or not a cuttingheight obtained by imaging the wafer W is an allowable value. If thecutting height is determined to be an allowable value, the reset numberof rinsing revolutions is stored in the storage part 102 as a parameterto be used at the time of processing the product wafer W. Accordingly,the setting of the number of rinsing revolutions for determining thecutting height can be automatically performed. Thus, the labor and timerequired for parameter adjustment is significantly reduced as comparedwith the case where the operator manually adjusts the number of rinsingrevolutions, which facilitates the parameter adjustment operation.

In addition to the operation of determining the cutting height, theoperation of determining whether or not the degree of contaminationobtained based on the imaging results of the outer end surface and therear surface of the wafer is an allowable value, is performed. If thedegree of contamination is not an allowable value, the operating ofresetting the cleaning time is also performed based on the referencedata. Then, in the coating module 2 again, the coating liquid is appliedon the wafer W for adjustment and the beveled portion cleaning isperformed. It is determined whether or not a degree of contaminationobtained by imaging the wafer W is an allowable value. If the degree ofcontamination is determine to be the allowable value, the reset cleaningtime is stored in the storage part 102 as a parameter to be used at thetime of processing the product wafer V. Accordingly, the setting of thecleaning time for determining the degree of contamination can beautomatically performed. This facilitates the parameter adjustmentoperation as compared with the case where the operator manually adjuststhe cleaning time.

In addition, when the first series of operations and the second seriesof operations are completed and subsequently the third series ofoperations are further performed, the actual data, instead of thereference data, is used for the resetting of the number of rinsingrevolutions or the cleaning time. Thus, the accuracy of the parametersto be reset is improved. Therefore, the time required for parameteradjustment is shortened, which facilities the parameter adjustmentoperation.

As described above, the transfer of the wafer W from the transfercontainer C to the coating module 2 and the transfer of the wafer W fromthe coating module 2 to the imaging module 3 are automatically performedby the transfer mechanism 11, and the resetting of the parameters isautomatically performed based on the reference data or the actual data.Thus, it is possible to efficiently perform the parameter adjustmentoperation. Moreover, since the parameter adjustment operation can beperformed without the operator's hands and is not dependent on theexperience value of the operator, it is possible to improve the accuracyof the adjustment operation. Furthermore, in the imaging module 3, sincethe outer end surface and the rear surface of the wafer W can besimultaneously imaged by the peripheral edge imaging part 4 and the rearsurface imaging part 5, it is possible to shorten the time required forthe adjustment operation. In addition, the number of repetitions of thebeveled portion cleaning is set in advance. When the set number ofrepetitions of the beveled portion cleaning exceeds a predeterminedvalve and when the cutting height or the degree of contamination isexceeds an allowable value, the adjustment operation is terminated.Thus, even when the automatic parameter adjustment is difficult, theparameter adjustment operation is automatically terminated. It istherefore possible to take subsequent countermeasures at an appropriatetiming.

In the above description, in the case where a plurality of coatingmodules are installed in the coating/developing apparatus 1, the actualdata already obtained by another coating module may be used as thereference data used for parameter adjustment in one coating module, forthe same type of coating film as the coating film used for parameteradjustment in one coating module. In the case where the plurality ofcoating modules are installed in the coating/developing apparatus 1,even when there are individual differences in the coating modules due tothe automatic adjustment of the parameters, the processing state becomesuniform and thus is effective.

Modification of First Embodiment

In this modification, only the parameter relating to the cutting heightapplied for the removal of the coating film in the beveled portion maybe adjusted. That is to say, the control part 100 may be configured suchthat the outer end surface and the rear surface of the wafer foradjustment processed in the coating module are imaged by the imagingmodule, only the cutting height is obtained based on the imaging result,whether or not the obtained cutting height is an allowable value isdetermined, and if the obtained cutting height is not the allowablevalue, the number of rinsing revolutions is reset based on the referencedata. Further, the control part 100 may be configured such that theapplication of the coating liquid is performed and the beveled portioncleaning is performed with the reset number of rinsing revolutions bythe coating module. In addition, the control part 100 may be configuredsuch that whether or not a cutting height is determined to be anallowable value in the same manner, and if the cutting height isdetermined to be an allowable value, the reset number of rinsingrevolutions is stored in the storage part 102 as a parameter to be usedat the time of processing the product wafer W.

For example, by the input part 105, one of the “number of rinsingrevolutions and cleaning time” and the “number of rinsing revolutions”may be selected as a parameter to be adjusted in advance, and theadjustment operation described above is performed on the selectedparameter. Also, in a case where only the “number of rinsingrevolutions” is adjusted, only the application of the coating liquid andthe beveled portion cleaning may be performed on the wafer W foradjustment in the coating module. In the aforementioned embodiment, thebeveled portion cleaning and the rear surface cleaning are performed atthe same time. However, the beveled portion cleaning may be initiallyperformed by discharging the removing liquid from the beveled portioncleaning nozzle 27, followed by stopping the discharge of the removingliquid from the beveled portion cleaning nozzle 27. Thereafter, the rearsurface cleaning may be performed by discharging the cleaning liquidfrom the cleaning nozzle 28. Even in this case, a cutting height and adegree of contamination are obtained by imaging the outer end surfaceand the rear surface of the wafer W. The adjustment of the number ofrinsing revolutions is performed based on the cutting height thusobtained and the adjustment of the cleaning time is performed based onthe degree of contamination thus obtained.

Second Embodiment

A second embodiment is an example in which an EBR process for removing acoating film in the peripheral portion with the removing liquid nozzle26 is performed. A process performed by the coating module 2 in thisembodiment will be briefly described with reference to FIGS. 18 to 21.The second embodiment is similar to the first embodiment in that thecoating liquid is applied to the wafer W mounted on the spin chuck 21and subsequently the liquid film is dried by rotating the water W for apredetermined period of time to form the coating film (FIG. 18).

Subsequently, as illustrated in FIG. 19, the EBR process is performed bydischarging the removing liquid from the removing liquid nozzle 26toward a surface inward of the beveled portion W0 in the wafer W whilerotating the wafer W. The removing liquid is discharged from theremoving liquid nozzle 26 such that it is directed to the downstreamside of the wafer W in the rotation direction and such that an extensionline of a discharge trace of the removing liquid is directed outward ofthe peripheral portion of the coating film. By virtue of the centrifugalforce generated by the rotation of the water W, the removing liquidquickly flows so as to be pushed out outward of the wafer W.Accordingly, in a region to which the removing liquid is supplied, thecoating film is softened and dissolved by the removing liquid. Theremoving liquid containing components of the dissolved coating film ispushed out outward of the wafer W by virtue of the centrifugal force andis removed. At this time, a cutting width of the coating film in the endportion of the wafer varies depending on the discharge position of theremoving liquid discharged from the removing liquid nozzle 26 to thewafer W. In addition, a degree of disturbance of the cut surface variesdepending on a drying time performed before the EBR process.

The degree of disturbance of the cut surface refers to how much of thecut surface from the outer edge of the coating film to the inner of thebeveled portion is disturbed. For example, a distance from the outeredge of the coating film to the inner edge of the beveled portion isdetected at 360 points of the wafer in the circumferential direction. A3-sigma is obtained from the detected values, and the degree ofdisturbance of the cut surface is evaluated using a valve of the3-sigma. The degree of disturbance of the cut surface is obtained basedon, for example, an imaging result acquired by imaging the peripheralregion Wa of the front surface of the wafer W by the peripheral edgeimaging part 4 of the imaging module 3. For example, the distance fromthe outer edge of the coating film to the inner edge of the beveledportion is acquired as the cutting height H. The degree of disturbanceof the cut surface depends on the drying time taken for the dryingprocess of the coating film before the EBR process. Thus, if the dryingtime is lengthened, the coated film is dried and is difficult to besoluble in the solvent, which alleviates the degree of disturbance ofthe cut surface.

Subsequently, as illustrated in FIG. 20, in a state where the wafer W isrotated, the cleaning liquid is discharged from the rear surfacecleaning nozzle 28 toward the rear surface of the wafer W so that therear surface cleaning is performed. In the rear surface cleaning, as inthe first embodiment, the longer the cleaning time, the smaller thedegree of contamination. After the EBR process and the rear surfacecleaning are performed in this manner, as illustrated in FIG. 21, thedischarge of the cleaning liquid from the rear surface cleaning nozzle28 is stopped, and then the removing liquid and the cleaning liquidexisting on the wafer W are shakes off dried by rotating the wafer W.

The control part 100 of the present embodiment is configured to obtainthe degree of disturbance of the cut surface from the imaging result ofthe front surface of the wafer W in the image analysis part 104, and toobtain the degree of contamination from the imaging results of the outerend surface and the rear surface of the wafer W as described above.Furthermore, the parameter adjustment program of this example has afunction of adjusting the drying time before the EBR process based onthe degree of disturbance of the cut surface, instead of the function ofadjusting the number of rinsing revolutions based on the cutting heightin the first embodiment. Other functions such as the function ofobtaining the degree of contamination from the imaging result of thewafer W and adjusting the cleaning time based on the degree ofcontamination thus obtained are similar to those in the firstembodiment, in addition to the operation of determining the degree ofdisturbance of the cut surface, and therefore, a description thereofwill be omitted.

For the adjustment of the drying time, the parameter adjustment programof the control part 100 has a function of determining whether or not thedegree of disturbance of the cut surface obtained based on the imagingresult of the wafer W is an allowable value, and if the degree ofdisturbance is not an allowable value, resetting the drying time beforethe EBR process based on the obtained degree of disturbance and areference data of the degree of disturbance of the cut surface. Thereference data refers to data indicating a relationship between thedegree of disturbance of the cut surface and the drying time which areprepared in advance. In addition, the parameter adjustment program has afunction of performing the application of the coating liquid, the dryingand the EBR process on the wafer W for adjustment using the reset dryingtime by the coating module 2, and thereafter determining whether or notthe degree of disturbance of the cut surface obtained from the imagingresult is an allowable value in the same manner. Then, if the degree ofdisturbance is an allowable value, the parameter adjustment program hasa function of storing the reset drying time in the storage part 102 as aparameter to be used at the time of processing the product wafer.

Furthermore, when the first series of operations and the second seriesof operations are completed and the third series of operations areperformed, the parameter adjustment program is configured to use anactual data instead of the reference data for the resetting of thedrying time. The actual data refers to data indicating a relationshipbetween a degree of disturbance and a drying time of the cut surface,which are obtained from a first degree of disturbance and a first dryingtime of the cut surface acquired in the first series of operations and asecond degree of disturbance and a second drying time of the cut surfaceacquired in the second series of operations.

The automatic adjustment of the parameters in the present embodimentwill be briefly described with reference to FIGS. 22 and 23, focusing ondifferences from the first embodiment. First, a coating module 2 foradjustment and a reference recipe stored in the storage part 102 areselected by the input part 105. For example, a reference data R3indicating a relationship between the degree of disturbance and thedrying time of the cut surface as illustrated in FIG. 23 and thereference data R2 (see FIG. 16) indicating a relationship between thedegree of contamination and the cleaning time of the rear surface arestored in the reference recipe. By selecting the reference recipe, forexample, an allowable value L2 of the degree of disturbance and a dryingtime T2 of the cut surface, an allowable value L1 of the degree ofcontamination and a cleaning time T1 are set.

Then, as described above, in the coating module 2, the coating liquid isapplied on the wafer W for parameter adjustment, the wafer W is driedduring the set drying time T2, the EBR process and the rear surfacecleaning are performed during the set cleaning time. Subsequently, thewafer W is imaged by the imaging module 3 so that an image data of theperipheral region Wa, the beveled portion W0, and the rear surface We ofthe wafer W is acquired (step S21).

Subsequently, a cutting width, a degree of disturbance and a degree ofcontamination of the cut surface are obtained based on the image data(step S22). A discharge position (landing position of the removingliquid in the coating film) of the removing liquid from the removingliquid nozzle 26 is adjusted based on the cutting width (step S23).Then, it is determined whether or not the degree of disturbance of thecut surface is an allowable value (step S24). If the degree ofdisturbance is an allowable value, the process proceeds to steps S26 andS34. In step S34, the drying time T2 at this time is stored in thestorage part 102 as a parameter to be used at the time of processing theproduct wafer, and the parameter adjustment operation of the drying timeis terminated.

If the degree of disturbance is determined to exceed an allowable value,the process proceeds to step S25 where the drying time is reset to belengthened based on the reference data R3. Thereafter, the processproceeds to step S26. In step S26, it is determined whether or not thedegree of contamination is an allowable value. If the degree ofcontamination is an allowable value, the process proceeds to step S34where the cleaning time T1 at this time is stored in the storage part102 as a parameter to be used at the time of processing the productwafer. Then, the parameter adjustment operation of the cleaning time isterminated. On the other hand, if the degree of contamination isdetermined to exceed an allowable value, the cleaning time is reset tobe lengthened based on the reference data R2 (step S27).

Subsequently, for example, with respect to another wafer W for parameteradjustment, the application of the coating liquid and the drying processat the reset drying time are performed by the coating module 2, and theEBR process and the rear surface cleaning at the reset cleaning time areperformed. The imaging module 3 images the wafer W to acquire an imagedata, and obtains a degree of disturbance and a degree of contaminationof the cut surface (step S28).

Then, in step S29, it is determined whether or not the degree ofdisturbance of the cut surface is an allowable value. If the degree ofdisturbance of the cut surface is an allowable value, the processproceeds to steps S32 and S34. In step S34, the drying time at this timeis stored as a parameter for processing, and the adjustment operation ofthe drying time is terminated. If the degree of disturbance of the cutsurface is determined to exceed an allowable value, the process proceedsto step S30 where it is determined whether or not the number of times ofEBR process exceeds a set number of times. If the number of times of EBRprocess exceed is determined to exceed the set number of times, theprocess goes to step S35 where it is determined that the parameteradjustment is impossible. For example, such an impossible state isdisplayed on the display part 106 and the adjustment operation isterminated.

If the number of times of EBR process is determined to not exceed theset number of times in step S30, the process proceeds to step S31 wherethe drying time is reset. Thereafter, the process proceeds to step S32.The resetting in step S31 is performed based on the actual data A3indicating a relationship between a degree of disturbance and a dryingtime of the cut surface, which is obtained from a first degree ofdisturbance and a first drying time of the cut surface acquired in thefirst series of operations and a second the degree of disturbance and asecond drying time of the cut surface acquired in the second series ofoperations.

In step S32, it is determined whether or not the degree of contaminationis an allowable value. If the degree of contamination is determined tobe an allowable value, the process proceeds to step S34 where thecleaning time at this time is stored as a parameter for processing, andthe adjustment operation of the cleaning time is terminated. On theother hand, if the degree of contamination is determined to exceed anallowable value, the process goes to step S33 where the cleaning time isreset. This resetting is performed based on an actual data indicating arelationship between a degree of contamination and a cleaning time,which is obtained from a first degree of contamination and a firstcleaning time acquired in the first series of operations and a seconddegree of contamination and a second cleaning time acquired in thesecond series of operations.

Subsequently, for example, with respect to another wafer W for parameteradjustment, the application of the coating liquid and the drying processat the reset drying time are performed in the coating module 2, and theEBR process and the rear surface cleaning at the reset cleaning time areperformed. The imaging module 3 images the wafer W to acquire an imagedata, and obtains a degree of disturbance and degree of contamination ofthe cut surface (step S28). In this manner, if the degree of disturbanceof the cut surface exceeds an allowable value while the number of timesof EBR process does not exceed the set number of times, the resetting ofthe drying time, the application of the coating liquid, the dryingprocess and the EBR process are performed. Subsequently, a series ofoperations of obtaining a degree of disturbance of the cut surface anddetermining whether or not the degree of disturbance is an allowablevalue is repeated. Also, if the degree of contamination exceeds anallowable value while the number of times of EBR process does not exceedthe set number of times, a series of operations of resetting thecleaning time, forming the coating film, performing the cleaningprocess, obtaining a degree of contamination, and determining whether ornot the degree of contamination is an allowable value, is repeated.

According to the present embodiment, the wafer for adjustment processedby the coating module 2 is transferred to the imaging module 3 by thetransfer mechanism 11. It is determined whether or not the degree ofdisturbance of the cut surface obtained based on the imaging result ofthe surface of the wafer for adjustment is an allowable value. If thedegree of disturbance is determined to be not an allowable value, thedrying time is reset based on the obtained degree of disturbance of thecut surface, and the reference data indicating a relationship betweenand the degree of disturbance of the cut surface and the drying timewhich are prepared in advance, and the process is again performed in thecoating module 2. Thereafter, it is determined whether or not the degreeof disturbance of the cut surface is an allowable value in the samemanner. If the degree of disturbance of the cut surface is determined tobe an allowable value, the reset drying time is stored in the storagepart 102 as a parameter for processing. Thus, the drying time can beautomatically adjusted, which facilitates the parameter adjustment.

Furthermore, when the first series of operations and the second seriesof operations are completed and the third series of operations arefurther performed, the resetting of the degree of disturbance of the cutsurface is performed using the actual data instead of the referencedata. Thus, the accuracy of the reset parameters is improved. Therefore,the time required for parameter adjustment is shortened and theparameter adjustment operation becomes easier.

Furthermore, it is determined whether or not the degree of contaminationobtained based on the imaging result of the front surface of the waferfor adjustment is an allowable value. If the degree of contamination isdetermined to be not an allowable value, the cleaning time is resetbased on the obtained degree of contamination and the reference dataindicating a relationship between and the degree of contamination andthe cleaning time which are prepared in advance. Thus, since thecleaning time can be automatically adjusted, it is possible to easilyperform the parameter adjustment. Other effects are similar to those inthe first embodiment.

In the above description, in the present embodiment, only the parametersrelating to the degree of disturbance of the cut surface may beadjusted. That is to say, the control part 100 may be configured suchthat the surface of the wafer for adjustment processed by the coatingmodule is imaged by the imaging module, only the degree of disturbanceof the cut surface is obtained based on the imaging result, whether ornot the obtained degree of disturbance of the cut surface is anallowable value is determined, and if the obtained degree of disturbanceis determined to be not the allowable value, the drying time is resetbased on the reference data. Further, the control part 100 may beconfigured such that the application of the coating liquid and thedrying process at the reset drying time are again performed in thecoating module, and subsequently the EBR process is performed.Thereafter, if it is determined whether or not the degree of disturbanceof the cut surface is an allowable value in the same manner. If thedegree of disturbance is determined to be an allowable value, the resetdrying time is stored in the storage part 102 as a parameter to be usedat the time of processing the product wafer.

While the control part 100 has been described to analyze the image datain the first embodiment and the second embodiment, a main control partfor controlling the coating/developing apparatus 1 and a dedicatedcontrol part for controlling the imaging module 3 may be installed sothat the analysis of the image data is performed by the dedicatedcontrol part. In this case, the main control part and the dedicatedcontrol part constitute the control part of the present disclosure. Inthe aforementioned embodiments, the plurality of wafers W for parameteradjustment is prepared. However, in a case where the parameters arereset and the process is again performed in the coating module 2, thecoating film of the wafer W for parameter adjustment processed by thecoating module 2 may be initially removed and subsequently the processmay be again performed in the coating module 2. In the above, theimaging module is not limited to the aforementioned example. As anexample, an imaging part configured to image the front surface of thewafer W may be installed separately.

Next, the overall configuration of the coating/developing apparatus 1will be described with reference to a plan view of FIG. 24 and alongitudinal cross-sectional view of FIG. 25. The coating/developingapparatus 1 is configured by linearly connecting a carrier block S1which constitutes a loading/unloading block, a processing block S2, andan interface block S3 in a lateral direction. In FIG. 24, referencesymbol S4 is an exposure apparatus. A water W received in a transfercontainer C mounted on a mounting table 81 of the carrier block S1 istransferred from and to the processing block S2 by a transfer mechanism83 via an opening/closing part 82.

The processing block S2 is configured by stacking unit blocks E1 to E6that perform a liquid process on the wafer W sequentially from below. Inthese unit blocks E1 to E6, the transfer and the process of the wafer Ware performed in parallel with each other. The unit blocks E1 and E2 aresimilar to each other in configuration, the unit books E3 and E4 aresimilar to each other in configuration, and the unit blocks E5 and E6are similar to each other in configuration.

The coating module 2 and the imagining module 3 described above areinstalled in the unit blocks E3 and E4. FIG. 24 is the plan view of theunit blocks E3 and E4. The coating module 2 is installed at one side ofa transfer path 12 of a transfer mechanism F3. The coating module 2 andthe imaging module 3 which are described above, and heating modules 13are installed on a shelf unit 71 installed at the other side of thetransfer path 12.

The unit blocks E1, E2, E5 and E6 are similar to the unit blocks E3 andE4 in configuration except that liquid chemicals supplied to the water Ware different from each other. Each of the unit blocks E1 and E2includes an anti-reflection film forming module configured to supply aliquid chemical for forming an anti-reflection film to the wafer W,instead of the coating module 2. Each of the unit blocks E5 and E6includes a developing module configured to supply a developing solutionas liquid chemical onto the wafer W to develop a resist film, instead ofthe coating module 2. In FIG. 25, transfer mechanisms of the unit blocksE1 to E6 are denoted as F1 to F6, respectively.

A tower 72 vertically extending across each of the unit blocks E1 to E6and an elevatable transfer mechanism 84 for transferring the wafer Wfrom and to the tower 72 are installed at the side of the carrier blockS1 in the processing block S2. The tower 72 is configured by a pluralityof modules stacked one above another, and includes transfer modules TRSon which the respective wafers W are mounted.

The interface block S3 includes towers 73, 74 and 75 which verticallyextend across the unit blocks E1 to E6. The interface block S3 includesan elevatable transfer mechanism 85 for transferring the wafer W betweenthe tower 73 and the tower 74, an elevatable transfer mechanism 86 fortransferring the wafer W between the tower 73 and the tower 75, and atransfer mechanism 87 for transferring the wafer W between the tower 73and the exposure apparatus S4.

The tower 73 is configured by stacking a transfer module TRS, a buffermodule that stores and holds a plurality of wafers W before exposureprocessing, a buffer module that stores a plurality of wafers W afterthe exposure processing, and a temperature adjustment module foradjusting a temperature of the wafer W and the like, above one another.Illustration of the buffer module and the temperature adjustment moduleis omitted herein. In FIG. 1, the semiconductor wafer transfer mechanism11 is shown as a transfer mechanism that also serves as the transfermechanism 83 and the transfer mechanisms F3 and F4, and the transfermodule and the like are omitted.

In a system including the coating/developing apparatus 1 and theexposure apparatus S4, a transfer route of the product wafer W will bebriefly described. The wafer W is transferred from the transfercontainer C to a transfer module TRS0 of the tower 72 in the processingblock S2 by the transfer mechanism 83. In the transfer module TRS0, thewafer W is allocated and transferred to the unit blocks E1 and E2.

The wafer W allocated in the transfer module TRS0 is transferred in theorder of a transfer module TRS1 (TRS2)→the anti-reflection film formingmodule→the heating module→the transfer module TRS1 (TRS2). Subsequently,the wafer W is allocated to a transfer module TRS3 (TRS2) correspondingto the unit block E3 and a transfer module TRS4 corresponding to theunit block E4 by the transfer mechanism 84.

The wafer W allocated to the transfer modules TRS3 and TRS4 in thismanner is transferred from the transfer module TRS3 (TRS4) to the unitblock E3 (E4) where the wafer W is successively processed by the coatingmodule 2 and the heating module 13. Thereafter, the wafer W istransferred to a transfer module TRS3 (TRS41) of the tower 73.Thereafter, the wafer W is loaded into the exposure apparatus S4 by thetransfer mechanisms 85 and 87 via the tower 74. In the exposureapparatus S4, the resist film is exposed.

The wafers W after the exposure are transferred between the towers 73and 75 by the transfer mechanisms 86 and 87, and are transferred torespective transfer modules TRS51 and TRS61 of the tower 73, whichcorrespond to the unit blocks E5 and E6. Thereafter, the wafer W istransferred to the heating module where the wafer W is subjected to aso-called post exposure bake PEB. Subsequently, the wafer W istransferred to the developing module where the developing solution issupplied onto the wafer W to form a resist pattern. Thereafter, thewafer W is transferred to a transfer module TRS5 (TRS6) of the tower 72and is then returned to the transfer container C via the transfermechanism 83.

According to the present disclosure in some embodiments, a coatingmodule and an imaging module are installed in a substrate processingapparatus. A semiconductor wafer for adjustment is processed by thecoating module and subsequently, is transferred to the imaging module bya semiconductor wafer transfer mechanism. An outer end surface and arear surface of the semiconductor wafer are imaged by the imagingmodule. Thereafter, based on the imaging result, a height dimension ofan outer edge of a coating film with respect to an inner edge of abeveled portion of the semiconductor wafer is obtained. It is determinedwhether or not the height dimension is an allowable value. If the heightdimension is determined to be not an allowable value, the number ofrevolutions of the semiconductor wafer is reset based on the obtainedheight dimension and a reference data indicating a relationship betweenthe height dimension and the number of revolutions of the semiconductorwafer which are prepared in advance. Since the number of revolutions,which is a parameter of the coating module, is automatically adjusted inthis manner, it is possible to easily adjust the parameter.

In addition, according to the present disclosure in some embodiments, asemiconductor wafer for adjustment processed by a coating module istransferred to an imaging module by a semiconductor wafer transfermechanism. Based on the imaging result on a surface of the semiconductorwafer for adjustment, which is obtained by the imaging module, a degreeof disturbance of a cut surface from an outer edge of a coating film toan inner edge of a beveled portion of the semiconductor water isobtained. Then, it is determined whether or not the obtained degree ofdisturbance is an allowable value. If the degree of disturbance isdetermined to be not an allowable value, a drying time is reset based onthe obtained degree of disturbance and a reference data indicating arelationship between the degree of disturbance and a drying time takenfor drying a coating film in order to remove the coating film in aperipheral portion of the semiconductor wafer, which are prepared inadvance. Since the drying time, which is a parameter to be used for theprocess in the coating module, is automatically adjusted, it is possibleto easily adjust the parameter.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the disclosures. Indeed, the embodiments described herein maybe embodied in a variety of other forms. Furthermore, various omissions,substitutions and changes in the form of the embodiments describedherein may be made without departing from the spirit of the disclosures.The accompanying claims and their equivalents are intended to cover suchforms or modifications as would fall within the scope and spirit of thedisclosures.

What is claimed is:
 1. A substrate processing apparatus for forming acoating film on a semiconductor wafer, comprising: a loading/unloadingblock into and from which a transfer container configured to accommodatea plurality of semiconductor wafers is loaded and unloaded; a coatingmodule configured to apply a coating liquid to each of the plurality ofsemiconductor wafers taken out of the transfer container loaded into theloading/unloading block, and subsequently, in a state where thesemiconductor wafer is rotated, discharge a removing liquid from abeveled portion film removing nozzle toward a beveled portion of thesemiconductor wafer to remove the coating film formed on the beveledportion; an imaging module including an imaging part configured to imagethe semiconductor wafer; a semiconductor wafer transfer mechanismconfigured to transfer the semiconductor wafer between the coatingmodule and the imaging module; a storage part; and a controllerconfigured to: control the imaging module to image an outer end surfaceof a semiconductor wafer for a parameter adjustment, which is processedby the coating module; obtain a height dimension of an outer edge of thecoating film with respect to an inner edge of the beveled portion of thesemiconductor wafer based on an imaging result obtained by the imagingmodule; determine whether or not the obtained height dimension is afirst allowable value; if the obtained height dimension is determined tobe not the first allowable value, reset a new number of revolutions ofthe semiconductor wafer; control the coating module to again perform theapplication of the coating liquid onto the semiconductor wafer for theparameter adjustment and the removal of the coating film formed on thebeveled portion; subsequently, determine whether the obtained heightdimension is the first allowable value; and if the obtained heightdimension is determined to be the first allowable value, store the resetnumber of revolutions of the semiconductor wafer in the storage part asa parameter for processing the semiconductor wafer as a product.
 2. Thesubstrate processing apparatus of claim 1, wherein when the new numberof revolutions of the semiconductor wafer is reset, the controllerperforms a control to remove the coating film of the semiconductor waferfor the parameter adjustment, which has been processed by the coatingmodule, and process the semiconductor wafer for the parameter adjustmentagain in the coating module.
 3. The substrate processing apparatus ofclaim 2, wherein the controller resets the new number of revolutions ofthe semiconductor wafer based on the obtained height dimension and afirst reference data indicating a relationship between apreviously-prepared height dimension and a previously-prepared number ofrevolutions of the semiconductor wafer.
 4. A substrate processingapparatus for forming a coating film on a semiconductor wafer,comprising: a loading/unloading block into and from which a transfercontainer configured to accommodate a plurality of semiconductor wafersis loaded and unloaded; at least one coating module configured to applya coating liquid to each of the plurality of semiconductor wafers takenout of the transfer container loaded into the loading/unloading block,and subsequently, in a state where the semiconductor wafer is rotated,discharge a removing liquid from a peripheral portion film removingnozzle toward a front surface inward of a beveled portion of thesemiconductor wafer to remove the coating film formed on the peripheralportion; an imaging module including an imaging part configured to imagethe semiconductor wafer; a semiconductor wafer transfer mechanismconfigured to transfer the semiconductor wafer between the at least onecoating module and the imaging module; a storage part; and a controllerconfigured to: control the imaging module to image the front surface ofa semiconductor wafer for a parameter adjustment, which is processed bythe at least one coating module; obtain a degree of disturbance of a cutsurface from an outer edge of the coating film to an inner edge of thebeveled portion of the semiconductor wafer based on an imaging resultobtained by the imaging module; determine whether or not the obtaineddegree of disturbance of the cut surface is a first allowable value; ifthe obtained degree of disturbance of the cut surface is determined tobe not the first allowable value, reset a new coating film drying time;control the at least one coating module to again perform the applicationof the coating liquid onto the semiconductor wafer for the parameteradjustment and the removal of the coating film formed on the peripheralportion; subsequently, determine whether or not the obtained degree ofdisturbance of the cut surface is the first allowable value; and if theobtained degree of disturbance of the cut surface is determined to bethe first allowable value, store the reset coating film drying time inthe storage part as a parameter for processing the semiconductor waferas a product.
 5. The substrate processing apparatus of claim 4, whereinwhen the new coating film drying time is reset, the controller performsa control to remove the coating film of the semiconductor wafer for theparameter adjustment, which has been processed by the coating module,and process the semiconductor wafer for the parameter adjustment againin the coating module.
 6. The substrate processing apparatus of claim 5,wherein the controller resets the new coating film drying time based onthe obtained degree of disturbance of the cut surface and a firstreference data indicating a relationship between a previously-prepareddegree of disturbance of the cut surface and a previously-preparedcoating film drying time required to dry the coating film prior toremoving the coating film formed on the peripheral portion.
 7. Thesubstrate processing apparatus of claim 6, wherein the at least onecoating module includes a plurality of coating modules, the firstreference data used in one coating module selected among the pluralityof coating modules is used as an actual data already obtained by anothercoating module selected among the plurality of coating modules, for thesame type of coating film as the coating film formed by the one coatingmodule.
 8. A method of adjusting a parameter during processing of acoating module in a substrate processing apparatus for forming a coatingfilm on a semiconductor wafer, wherein the apparatus includes: aloading/unloading block into and from which a transfer containerconfigured to accommodate a plurality of semiconductor wafers is loadedand unloaded; a coating module configured to apply a coating liquid toeach of the plurality of semiconductor wafers taken out of the transfercontainer loaded into the loading/unloading block, and subsequently, ina state where the semiconductor wafer is rotated, discharge a removingliquid from a beveled portion film removing nozzle toward a beveledportion of the semiconductor wafer to remove the coating film formed onthe beveled portion; an imaging module including an imaging partconfigured to image the semiconductor wafer; a semiconductor wafertransfer mechanism configured to transfer the semiconductor waferbetween the coating module and the imaging module; and a storage part,the method comprising: imaging, by the imaging module, an outer endsurface of a semiconductor wafer for a parameter adjustment, which isprocessed by the coating module; obtaining a height dimension of anouter edge of the coating film with respect to an inner edge of thebeveled portion of the semiconductor wafer based on an imaging resultobtained by the imaging module; determining whether or not the obtainedheight dimension is a first allowable value; if the obtained heightdimension is determined to be not the first allowable value, resetting anew number of revolutions of the semiconductor wafer; controlling thecoating module to again perform the application of the coating liquidonto the semiconductor wafer for the parameter adjustment and theremoval of the coating film formed on the beveled portion; subsequently,determining whether or not the obtained height dimension is the firstallowable value; and if the obtained height dimension is determined tobe the first allowable value, storing the reset number of revolutions ofthe semiconductor wafer in the storage part as the parameter forprocessing the semiconductor wafer as a product.
 9. The method of claim8, further comprising: when the new number of revolutions of thesemiconductor wafer is reset, controlling the coating module to removethe coating film of the semiconductor wafer for the parameteradjustment, which has been processed by the coating module, and processthe semiconductor wafer for the parameter adjustment again in thecoating module.
 10. The method of claim 9, wherein in the resetting thenew number of revolutions, the new number of revolutions of thesemiconductor wafer is reset based on the obtained height dimension anda first reference data indicating a relationship between apreviously-prepared height dimension and a previously-prepared number ofrevolutions of the semiconductor wafer.
 11. A non-transitorycomputer-readable recording medium storing a computer program for use ina substrate processing apparatus for forming a coating film on asemiconductor wafer, the apparatus comprising: a loading/unloading blockinto and from which a transfer container configured to accommodate aplurality of semiconductor wafers is loaded and unloaded; a coatingmodule configured to apply a coating liquid to each of the plurality ofsemiconductor wafers taken out of the transfer container loaded into theloading/unloading block; an imaging module including an imaging partconfigured to image the semiconductor wafer; and a semiconductor wafertransfer mechanism configured to transfer the semiconductor waferbetween the coating module and the imaging module, wherein the computerprogram includes a group of steps for executing the method of claim 8.12. A method of adjusting a parameter during processing of a coatingmodule in a substrate processing apparatus for forming a coating film ona semiconductor wafer, wherein the apparatus includes: aloading/unloading block into and from which a transfer containerconfigured to accommodate a plurality of semiconductor wafers is loadedand unloaded; at least one coating module configured to apply a coatingliquid to each of the plurality of semiconductor wafers taken out of thetransfer container loaded into the loading/unloading block, andsubsequently, in a state where the semiconductor wafer is rotated,discharge a removing liquid from a peripheral portion film removingnozzle toward a front surface inward of a beveled portion of thesemiconductor wafer to remove the coating film formed on the peripheralportion; an imaging module including an imaging part configured to imagethe semiconductor wafer; a semiconductor wafer transfer mechanismconfigured to transfer the semiconductor wafer between the at least onecoating module and the imaging module; and a storage part, the methodcomprising: controlling the imaging module to image the front surface ofa semiconductor wafer for a parameter adjustment, which is processed bythe at least one coating module; obtaining a degree of disturbance of acut surface from an outer edge of the coating film to an inner edge ofthe beveled portion of the semiconductor wafer based on an imagingresult obtained by the imaging module; determining whether or not theobtained degree of disturbance of the cut surface is a first allowablevalue; if the obtained degree of disturbance of the cut surface isdetermined to be not the first allowable value, resetting a new coatingfilm drying time; controlling the at least one coating module to againperform the application of the coating liquid onto the semiconductorwafer for the parameter adjustment and the removal of the coating filmformed on the peripheral portion; subsequently, determining whether ornot the obtained degree of disturbance of the cut surface is the firstallowable value; and if the obtained degree of disturbance of the cutsurface is determined to be the first allowable value, storing the resetcoating film drying time in the storage part as the parameter forprocessing the semiconductor wafer as a product.
 13. The method of claim12, further comprising: when the new coating film drying time is reset,controlling the coating module to remove the coating film of thesemiconductor wafer for the parameter adjustment, which has beenprocessed by the coating module, and process the semiconductor wafer forthe parameter adjustment again in the coating module.
 14. The method ofclaim 13, in the resetting the new coating film drying time, the newcoating film drying time is reset based on the obtained degree ofdisturbance of the cut surface and a first reference data indicating arelationship between a previously-prepared degree of disturbance of thecut surface and a previously-prepared coating film drying time requiredto dry the coating film prior to removing the coating film formed on theperipheral portion.
 15. The method of claim 14, wherein the at least onecoating module includes a plurality of coating modules, the firstreference data used in one coating module selected among the pluralityof coating modules is used as an actual data already obtained by anothercoating module selected among the plurality of coating modules, for thesame type of coating film as the coating film formed by the one coatingmodule.
 16. A non-transitory computer-readable recording medium storinga computer program for use in a substrate processing apparatus forforming a coating film on a semiconductor wafer, the apparatuscomprising: a loading/unloading block into and from which a transfercontainer configured to accommodate a plurality of semiconductor wafersis loaded and unloaded; a coating module configured to apply a coatingliquid to each of the plurality of semiconductor wafers taken out of thetransfer container loaded into the loading/unloading block; an imagingmodule including an imaging part configured to image the semiconductorwafer; and a semiconductor wafer transfer mechanism configured totransfer the semiconductor wafer between the coating module and theimaging module, wherein the computer program includes a group of stepsfor executing the method of claim 12.